Packaging
At KOSCO, we specialize in next-generation semiconductor packaging technologies that maximize device performance, integration density, and thermal efficiency.
Our core competencies include advanced packaging architectures such as Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP), 2.5D/3D IC integration, and Through-Silicon Via (TSV) interconnects—designed to meet the evolving demands of high-performance computing, automotive electronics, and next-generation communication systems.
Our comprehensive service portfolio spans package design and layout simulation, substrate engineering, precision die bonding, flip-chip assembly, and highly accelerated stress testing (HAST), all aligned with industry standards including JEDEC, IPC, and AEC-Q100. By incorporating high-density interconnect (HDI) structures, low-k dielectric materials, and advanced thermal interface solutions, we ensure signal integrity, power integrity, and robust reliability.
KOSCO integrates state-of-the-art process automation, inline optical/electrical inspection, and AI-driven defect analytics to support zero-defect manufacturing and agile product ramp-up. From concept to mass production, we deliver highly customized and scalable solutions to clients across consumer electronics, automotive, telecommunications, industrial, and aerospace sectors.
With a steadfast commitment to innovation, quality, and time-to-market excellence, KOSCO is your strategic partner in shaping the future of semiconductor packaging.
Semiconductor Package Substrate
It is a critical component in the semiconductor packaging process—a high-density interconnect (HDI) substrate featuring ultra-fine circuitry that electrically links the semiconductor die to the mainboard or system-level interconnects.
This advanced package substrate ensures precise signal transmission, power distribution, and thermal management within compact device architectures.
Engineered for applications demanding superior reliability and performance, such as automotive electronics, smartphones, and high-end mobile devices, it supports high I/O counts, fine pitch ball grid arrays (BGA), and multilayer routing.
The use of low-loss dielectric materials, microvia structures (via-in-pad, stacked via), and embedded passive components enhances electrical performance while minimizing form factor and signal distortion.
Its robust design meets stringent automotive-grade standards (AEC-Q100, ISO 26262) and thermal cycling requirements, making it ideal for mission-critical environments that require both miniaturization and durability.
System-in-Package
KOSCO’s advanced semiconductor packaging solutions are powered by a suite of next-generation technologies, including double-sided molding (DSM), EMI electromagnetic shielding, and laser-assisted bonding (LAB)—each engineered to enhance performance, reliability, and form factor optimization.
Double-Sided Molding (DSM):This advanced packaging technique encapsulates components on both sides of the substrate, enabling vertical integration of multiple dies and passive devices within a reduced footprint. DSM significantly shortens interconnect paths, thereby lowering parasitic resistance and inductance, improving signal integrity, and enhancing overall electrical performance.
It also contributes to thermal balancing and structural rigidity of the package.
EMI Electromagnetic Shielding:Utilizing advanced back-side metallization and conformal shielding layers, our EMI suppression technology minimizes electromagnetic interference in high-speed, high-frequency applications.
This not only ensures signal fidelity but also enhances thermal conductivity—crucial for applications such as automotive, 5G, and AI accelerators, where electromagnetic compliance (EMC) and thermal reliability are critical.
Laser-Assisted Bonding (LAB):LAB technology enables localized, high-precision thermal activation for interconnect bonding, effectively mitigating traditional reflow-related issues such as coefficient of thermal expansion (CTE) mismatch, substrate warpage, and high thermo-mechanical stress. LAB delivers superior joint quality, fine-pitch compatibility, and excellent reliability—making it ideal for heterogeneous integration and advanced 2.5D/3D package assemblies.
Together, these technologies enable KOSCO to provide cutting-edge packaging solutions that meet the rigorous demands of emerging markets, from autonomous vehicles and mobile devices to data centers and aerospace electronics.
Flip Chip Packaging
KOSCO offers a comprehensive Flip Chip packaging portfolio that spans from large-area single-die packages with integrated passive components to high-density multi-die modules and advanced 2.5D/3D heterogeneous integration. Our solutions support a wide range of form factors and performance requirements, enabling exceptional scalability, electrical performance, and thermal management.
Our Flip Chip technologies utilize high-density interconnect (HDI) substrates, fine-pitch micro bumping, underfill materials with enhanced reliability, and advanced warpage control techniques. We also provide innovative low-cost packaging options—including organic substrates and panel-level processing—without compromising on performance or quality.
For complex system-in-package (SiP) and multi-die applications, we enable vertical and lateral integration using Through-Silicon Via (TSV), silicon interposer, and redistribution layer (RDL) technologies. These architectures are optimized for applications in high-performance computing (HPC), automotive ADAS, mobile APs, and next-generation AI/5G systems.
By combining process expertise with advanced simulation, reliability testing, and global manufacturing capability, KOSCO delivers Flip Chip solutions that meet the highest standards of signal integrity, power efficiency, and mechanical durability—driving innovation across the semiconductor landscape.
Flip Chip Packaging
Laminate-based Ball Grid Array (BGA) interconnect technology was introduced as a robust response to the growing demand for higher I/O density in advanced semiconductor devices. Featuring solder balls arranged in an array on the bottom side of the package, BGA technology offers a compact, thermally efficient, and mechanically reliable solution for high-performance, surface-mount applications.
BGA packages deliver multiple advantages—including low parasitic inductance, improved electrical performance, high solder joint reliability, and simplified PCB assembly—making them ideal for consumer electronics, automotive control units, telecommunications infrastructure, and high-speed computing platforms.
KOSCO provides a full portfolio of laminate-based BGA packaging solutions, tailored to meet diverse design and performance requirements:
- Fine-pitch BGA: Supports high I/O density and miniaturization with excellent signal integrity for high-frequency and high-speed interfaces.
- Ultra-thin and low-profile BGA: Enables integration into space-constrained applications such as mobile devices and wearables.
- Multi-die and stacked-die BGA: Facilitates vertical integration and system-in-package (SiP) designs, combining memory, logic, and analog components in a single package.
- Thermally enhanced BGA: Incorporates heat spreaders, thermal vias, and copper coin inserts to improve heat dissipation in high-power applications.
Our BGA solutions are manufactured using high-performance organic substrates, advanced via structures (e.g., laser-drilled microvias, via-in-pad), and precise warpage control techniques to ensure mechanical stability and yield. KOSCO also offers extensive reliability testing, including thermal cycling, drop test, and high-temperature storage, to guarantee product performance in mission-critical environments.
With a commitment to innovation, scalability, and quality, KOSCO’s laminate-based BGA packages are engineered to support next-generation semiconductor applications across global markets.
With a commitment to innovation, scalability, and quality, KOSCO’s laminate-based BGA packages are engineered to support next-generation semiconductor applications across global markets.
Wafer Level & Fan Out Packaging
KOSCO is a recognized industry leader in delivering a comprehensive suite of wafer-level packaging (WLP) technologies, engineered to meet the demands of ultra-compact, high-performance, and cost-sensitive semiconductor applications. Our platform encompasses a full spectrum of solutions, including:
- Fan-In Wafer-Level Packaging (FIWLP): Optimized for space-constrained applications, FIWLP enables ultra-small form factors by routing I/O within the die footprint. It is widely adopted in mobile and wearable devices for its low profile and excellent electrical performance.
- Fan-Out Wafer-Level Packaging (FOWLP): A next-generation solution that allows redistribution of I/O beyond the die edge, FOWLP supports higher pin counts, improved thermal performance, and enhanced electrical characteristics. It is ideal for RF, AP, PMIC, and heterogeneous integration.
- Integrated Passive Devices (IPD): Utilizing advanced thin-film processing on glass or silicon substrates, IPD technology enables the integration of high-Q inductors, capacitors, and resistors, supporting miniaturization and improved signal integrity in RF front-end and power management systems.
- Through-Silicon Via (TSV): TSV technology facilitates vertical stacking of chips with high interconnect density and low latency, enabling 2.5D and 3D integration architectures for memory, logic, and high-bandwidth computing applications.
- Encapsulated Chip Package (ECP): ECP provides robust environmental protection and electrical insulation for bare dies and passive components, with embedded die solutions that support thin profiles, high reliability, and multi-die integration.
- Radio Frequency Identification (RFID): KOSCO's RFID packaging solutions leverage wafer-level processes to deliver ultra-thin, low-cost, and highly reliable tags optimized for IoT, logistics, and asset tracking applications.
By integrating advanced lithography, wafer thinning, RDL (Redistribution Layer) formation, and high-yield molding technologies, KOSCO delivers wafer-level solutions that align with the industry's most demanding performance, form factor, and integration requirements—paving the way for innovation in consumer electronics, automotive, industrial, and communication sectors.