Test Services  


At KOSCO, we deliver comprehensive semiconductor testing services designed to ensure top-tier quality, performance, and reliability across all device types.Our state-of-the-art facilities and technology-driven capabilities empower us to perform highly precise evaluations for a wide spectrum of products—from ICs and memory chips to advanced packaging solutions.
We provide specialized and customized testing solutions that span the full test flow:
  1. Wafer-Level Testing
  2. Final Product Validation
  3. Advanced Reliability and Performance Analysis
By integrating technological excellence, domain specialization, and process optimization, KOSCO ensures your products not only meet but exceed industry standards.With a commitment to accuracy, efficiency, and customer satisfaction, we stand as your reliable partner in achieving semiconductor excellence.
Let KOSCO elevate your product success with our trusted testing expertise.



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Probe Test
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KOSCO provides competitive Wafer Probe Test Service as follows.

As per Customer’s Device Specifications,Parameters,Vectors and Test Programs
  1. 6, 8 & 12” Wafers and Bumped Wafers
  2. Temperature Range : -55 ℃ to +150 ℃
  3. Class 1K Particle Environment

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Final Test


KOSCO provides competitive Final Test Services as follows.

As per Customer’s Device Specifications,Parameters,Vectors and Test Programs
  1. Wide range of IC packages such as PDIP, PLCC, SOIC, QFP, LQFP, TQFP, QFN, MLF, BGA, LGA, SIP, Flip Chip, POP, PLP and others
  2. Pick&Place and Turret Handlers available
  3. Temperature Range : -55 ℃ to +150 ℃
  4. Class 10K Particle Environment
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Backend


KOSCO provides competitive post-processing services as follows.

  1. Lead,Ball and Package Inspections
  2. Marking Inspections
  3. Bake Dry
  4. Tray and Tape&Reel PackingsShipments to Customer Sites or Customer’s Customer Locations
  5. Class 10K Particle Environment