​KOSCO INDUSTRIES

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Test & packaging

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Semiconductor post-processing and test facilities

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Glass Defects Detection Machine

Glass Defects Detection Machine is a fully automated detector that focuses on identifying defects in glass. This equipment combines a high-precision camera and special LED with our independently developed CCD software to detect scratches, smudges, corrosion, white and black dots, foreign matter, and concave or convex points. This significantly reduces the cost of traditional manual labor.
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Light Guide Plate Detector Equipment

This system consists of a horizontal four-joint robot, an automatic cleaner, a film cover device, and CCD AI software. It is primarily used to detect surface defects on LGP, such as white dots, scratches, and smudges. The horizontal four-joint robot used in this equipment is able to move quickly and precisely, and it is also easy to manipulate. When combined with CCD detecting software, it is capable of significantly enhancing production efficiency.
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Line scanning AOI device based on deep learning

The products from the assembly line are transported to the visual inspection station via the conveying mechanism. Subsequently, they are captured by the line scan camera at the station from various angles, including the front and the side. The AOI visual inspection system simulates the human eye to detect products, distinguishing between qualified and defective items, which are then sorted and discharged by the conveying mechanism.
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Flip-chip Mounter

The reclaimer arm will transport the dies to the wafer expanding device, and the substrates reclaimer will transport the substrates to the conveyor belt, which will then send the substrates to the working area simultaneously. The conveyor belt will transport two substrates simultaneously under the guidance of machine vision. On the other hand, the ejector pin will lift the die, and the flip-action arm will pull the die and rotate it 180 degrees to allow the mounter arm to remove the die and transfer it to the scaling powder station. After dipping in flux, the mounting arm will place the DIE on the substrate precisely under the guidance of machine vision. When two substrates are fully loaded, they will be transported to the receiver in the same way as the wafer.
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We are a semiconductor packaging company committed to delivering world-class technological expertise and innovative solutions to meet the evolving needs of our customers.
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