Packaging
At KOSCO, we specialize in advanced semiconductor packaging solutions that enhance performance, reliability, and efficiency.
Our cutting-edge technologies and expertise enable the seamless integration of semiconductor devices into compact, high-performing packages.
We offer comprehensive services, including design, assembly, testing, and quality assurance, tailored to meet the diverse needs of our clients across industries such as consumer electronics, automotive, telecommunications, and more.
With a commitment to innovation and excellence, we are dedicated to driving the future of semiconductor technology.
Partner with us to achieve unparalleled success in your semiconductor packaging needs.
Semiconductor Package Substrate
It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
It is used for automotive and various mobile devices that require high reliability.
System-in-Package
KOSCO solutions are enhanced by multiple advanced technologies including double-sided molding technology, EMI electromagnetic shielding technology, and laser-assisted bonding (LAB).
- Double-sided molding: the technology effectively reduces the package size, shortens the connection of multiple dies and passive devices, reduces resistance, and improves the electrical performance of the system.
- EMI shielding: JCET uses back metallization technology to effectively improve thermal conductivity and EMI shielding.
- Laser-assisted bonding (LAB): the technology is able to overcome traditional reflow bonding problems, such as CTE mismatch, high warpage, high thermal mechanical stress, and other reliability problems.
Flip Chip Packaging
KOSCO offers a broad Flip Chip portfolio--from large single die packages with passive components to modules and complex advanced 3D packaging, with a variety of low cost and innovative options.
Wafer Level & Fan Out Packaging
KOSCO is an industry leader in providing a comprehensive platform of wafer level technology solutions including Fan-in Wafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP), Integrated Passive Devices (IPD), Through Silicon Via (TSV), Encapsulated Chip Package (ECP), and Radio Frequency Identification (RFID).
Wirebond Packaging
Laminate-based Ball Grid Array interconnect technology(BGA) was first introduce as a solution to the increasingly high lead counts required for advanced semiconductors. BGA technology features leads on the bottom surface of the package in the form of small bumps or solder balls, and provides low inductance, ease of surface mounting, relatively low cost, and excellent package reliability. KOSCO offers a full suite of laminate-based BGA packages, including fine pitch, extremely thin, multi-die, stacked, and thermally enhanced configurations.