Test Services  


At KOSCO, we provide comprehensive semiconductor testing services to ensure the highest levels of quality, performance, and reliability for your devices.
Our state-of-the-art facilities and advanced testing technologies enable us to conduct precise evaluations across a wide range of semiconductor products, including ICs, memory chips, and advanced packaging solutions. 
From wafer-level testing to final product validation, we deliver tailored testing solutions to meet your unique requirements.
With a focus on accuracy, efficiency, and customer satisfaction, we are your trusted partner in delivering semiconductor products that exceed industry standards. 
Let us support your success with our reliable testing expertise.



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Probe Test
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KOSCO provides competitive Wafer Probe Test Service as follows.

As per Customer’s Device Specifications,Parameters,Vectors and Test Programs
  1. 6, 8 & 12” Wafers and Bumped Wafers
  2. Temperature Range : -55 ℃ to +150 ℃
  3. Class 1K Particle Environment

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Final Test


KOSCO provides competitive Final Test Services as follows.

As per Customer’s Device Specifications,Parameters,Vectors and Test Programs
  1. Wide range of IC packages such as PDIP, PLCC, SOIC, QFP, LQFP, TQFP, QFN, MLF, BGA, LGA, SIP, Flip Chip, POP, PLP and others
  2. Pick&Place and Turret Handlers available
  3. Temperature Range : -55 ℃ to +150 ℃
  4. Class 10K Particle Environment
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Backend


KOSCO provides competitive post-processing services as follows.

  1. Lead,Ball and Package Inspections
  2. Marking Inspections
  3. Bake Dry
  4. Tray and Tape&Reel PackingsShipments to Customer Sites or Customer’s Customer Locations
  5. Class 10K Particle Environment